Company Profile
Company Profile
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Founded in October 1997, CoAsia was offering IC design service business in the beginning with
capital of NT$80 million.
CoAsia is recognized by both its partners and suppliers also cooperating with customers for their continuous endeavor to service quality in system design. In 2003, CoAsia was named a “Windows Embedded Partner” by Microsoft Inc. and in 2004, as the No. 1 “Mobile Solution Partner” in the world by Samsung Semiconductor. CoAsia is expected to soon become the leading company in providing total solution for mobile multimedia. Due to strong market demands, the sales volume of mobile solutions jumped in 2005 and reached a ratio of 60-40% compared to the sales volume of IC design service.
CoAsia is dedicated to serve its partners and customers, providing the best components for their mass production. To cope with the quick changes in the technology market, CoAsia runs flexibly and efficiently, increasing profitability. In 2004, CoAsia was successfully listed in the Taiwan OTC market so as to gather more investment funds to strengthen its capital structure.
To meet the dynamic demands of personal mobile communication in smart device integrated products for the global consumer market, CoAsia is aggressively introducing Samsung’s most advanced, low power, high performance mobile multimedia cores, AP, Memory, AMOLED, CMOS image sensor (CIS) for our business partners.
CoAsia strives to lead the mobile solution industry with its total solution abilities which compliments the superior competitive strengths of Samsung semiconductor components.
Organization
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Executives
Name :
Hee Jun Lee
Title :
Chairman/CEO
Education :
BS Degree in Konkuk
University‏ of EE
Career :
Samsung Electronics-Semiconductor
Name :
Dong Soo Shin
Title :
President
Education :
BS degree in Sungkyunkwan
University of EE
Career :
Samsung Electronics-Semiconductor
Name :
Yuan Fu Cheng
Title :
CFO
Education :
MBA Degree in Tulane
University
Career :
Alpha Network