CoAsia Semi (CEO DS Shin) announced that it has begun supplying SoC products incorporating 3D IC packaging, expanding its business scope into the 3D IC packaging ecosystem. This represents the first successful case in which a domestic design service (DS) company has successfully carried out a 3D IC packaging project.

The 3D IC package applied to this product vertically stacks customized DRAM and SoC using TSV (Through-Silicon Via) technology. Compared to conventional 2D and 2.5D packaging, it shortens signal transmission paths and increases bandwidth, thereby enhancing performance, power efficiency, and integration density simultaneously. As a highly complex process requiring advanced design and verification capabilities, 3D IC technology is expected to see wider adoption in high-performance computing areas such as AI, data centers, and autonomous driving.
 

CoAsia Semi has begun supplying the product this month for customer validation and testing purposes, with plans to enter full-scale mass production within the year. Details on the customer and contractual terms remain undisclosed at the customer’s request for trade secret protection.
 

DS Shin, CEO of CoAsia Semi, stated, “Rather than remaining within the boundaries of existing technologies such as HBM and advanced packaging, we have proactively invested in next-generation 3D IC technology — and this product supply is the result of those efforts.” He added, “By meeting export compliance standards ahead of others among domestic design houses and securing export approval amid global semiconductor trade regulations, CoAsia Semi has established a business foundation that enables collaboration with overseas customers, including those in China, without regulatory constraints.”