CoAsia SEMI (CEO DS Shin) has become the first company in Korea’s design service provider (DSP) industry to enter mass production of a system-on-chip (SoC) featuring 3D IC (three-dimensional integrated circuit) packaging.

Starting with a 3D IC packaging project in January and progressing through to mass production, CoAsia SEMI has demonstrated that it is leading the way in the 3D IC packaging field. 3D IC packaging requires a high degree of customized design tailored to customer requirements, and its complex manufacturing process makes mass production highly challenging. This is why, although many companies are engaged in development, it is difficult to reach actual mass production.
 

3D IC packaging is a technology that vertically stacks multiple dies, including DRAM and logic SoCs, using vertical interconnect technologies such as through-silicon vias (TSVs). Compared with conventional 2D and 2.5D structures, in which memory and logic are placed side by side, 3D IC packaging can provide higher memory bandwidth and improve data transfer efficiency, making it advantageous for Agentic AI, which has recently been gaining attention. Leading global semiconductor companies, including Qualcomm, are also reportedly moving to strengthen their 3D IC capabilities to secure next-generation AI memory technologies.
 

The product that CoAsia SEMI has now begun mass-producing applies the latest WoW (Wafer-on-Wafer) hybrid bonding technology, vertically stacking multiple customized DRAM dies on top of a logic SoC. Compared with the CoW (Chip-on-Wafer) method, in which individual dies are stacked separately, the company explained that the WoW approach significantly reduces the distance between layers, substantially improving large-scale data processing performance.
 

DS Shin, CEO of CoAsia SEMI, said, “For next-generation system semiconductors such as those using 3D packaging, not only design capabilities but also collaboration with stakeholders across the value chain—including customer fabless companies, foundries, and OSAT providers—as well as supply chain management capabilities to secure key components for mass production are all important.”

He added, “In addition, another project incorporating 3D packaging is in the final stages of development, and we are currently in discussions with multiple global customers regarding development and supply cooperation.”