CoAsia
Korean DSPs Ride Samsung Foundry Momentum, Reaching 70% of Last Year’s Sales in H1
2026.08.24
CoAsia
CoAsia SEMI Begins Mass Production of SoC with 3D IC Packaging, a First in Korea’s Design Service Industry
2026.08.11
CoAsia
CoAsia CM Recruits Former Samsung Camera Module Development Executive as New CEO
2026.07.01
CoAsia
CoAsia SEMI Expands Advanced Packaging for AI Applications as Overseas Sales Share Rises
2026.06.13
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#CoAsiaCoAsia Receives the ‘70 Million-Dollar Export Tower’ at the 62nd Trade Day Ceremony
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#CoAsia SEMICoAsia SEMI and Germany’s Inova Sign ISELED Wafer Manufacturing License Agreement
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#CoAsia SEMICoAsia Semi Signs Supply Agreement with Anabatic Semi for Next-Generation BMS Semiconductor
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#CoAsia CMCoAsia CM Achieves Third Consecutive Quarterly Profit, Anticipates Full-Year Profitability
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#CoAsia SEMICoAsia Semi Unveils Chiplet Platform ‘CoCs™’ at Arm Unlocked Seoul 2025
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#CoAsia SEMICoAsia SEMI Joins Arm Total Design as an Official Partner
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#CoAsia SEMICoAsia SEMI and Rebellions Join Forces to Jointly Develop Next-Generation AI Chiplet Based on REBEL